Copper plating - Definition

Copper plating is the process in which a layer of copper is deposited on the item to be plated by using an electric current. An electrolyte of copper sulfate is typically used, with a mixture of sulfuric acid to decrease the resistance. A current of 1-10 amps per square foot of the item to be placed is used. With a higher current, hydrogen bubbles will form on the item to be plated, leaving surface imperfections. Performance can be enhanced by using a high purity copper sulfate and/or using distilled water. Often various other chemicals are added to improve plating uniformity and brightness. Without some form of additive, it is almost impossible to obtain anything close to reasonable plating. These additives can be anything from dish soap to proprietary compounds.