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In electronics, a Dual In-line Package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and a row of electrical connecting pins along each of two opposite sides, usually the longer sides of the rectangle.
Note: DIPs may be used for integrated circuits ("chips"), like microprocessors, or for discrete components such as resistors or toggle switches. A typical DIP may be a microcircuit package with two rows of seven vertical leads that is specially designed for mounting on a printed circuit board.
JEDEC-standard DIPs have the inter-lead spacing specified as 0.1" (2.54 mm) and the row spacing is specified at 0.3" (7.62 mm).
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